Observation

SEM
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JCM-6000 (JEOL)

Mag : 10x ~ 60000x

X-ray CT machine
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Xradia 520 Versa (ZEISS)

Objective lens: 5x, 10x, 20x, 50x, 100x

Max voltage : 160 kV

Max output : 10 W

Spatial resolution : 0.7 μm

Digital microscope
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VHX-8000 (KEYENCE)

Mag : 0x ~ 6000x

Digital microscope
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VHX-7000 (KEYENCE)

Mag : 20x ~ 6000x

Digital microscope
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VHX-6000 (KEYENCE)

Mag : 20x ~ 6000x

Digital microscope
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VHX-5000 (KEYENCE)

Mag : 30x ~ 5000x

Laser microscope
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LEXT OLS4000 (OLYMPUS)

Objective lens: 5x, 10x, 20x, 50x, 100x

Laser: 405nm semiconductor laser

Planar resolution : 0.12 μm

Hight resolution : 0.01 μm

High speed camera
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HPV-X2 (SHIMADZU)

Recording speed (frame rate) : max 10 million frames/second

Resolution : 50000 pixels

High speed camera
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VW-9000 (Keyence)

Recording speed (frame rate) : max 230 000 frames/second

Resolution : max 1920 × 1440 pixels

Infrared camera
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FLIR A6701

Temperature sensitivity: < 20 mK

Spatial resolution: 5 µm

Field of view: 3.2 x 2.56 mm

Working distance: 30 mm

Mechanical Test

Universal testing machine
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AG-100kNXplus (SHIMADZU)

Capacity : 100 kN

Crosshead speed : 0.0005 ~ 1000 mm/min

Universal testing machine
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AG-5000C (SHIMADZU)

Fatigue testing machine
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Survo pulser EHF-E (SHIMADZU)

Pneumatic fatigue testing system
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Air Servo Mini(SHIMADZU), AC021-012

Maximum force: ±1kN

Maximum stroke: ±10mm

Applicable specimen: W6×T1.5

Fatigue testing machine
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MMT-500N (SHIMADZU)

Capacity : 500 N

Small Tensile Testing Machine
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MT5000DL (DEBEN)

Capacity: 5000 N

Displacement: 10 mm

Temperature: Room temperature to 525 °C

Hardness testing machine
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DUH-211 (SHIMADZU)

Load range : 0.1 ~ 1961 mN

Depth resolution : 0.1 nm

Nanoindenter
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iMicro Nanoindenter (KLA)

Load resolution : 3 nN

Max load : 50 mN

Depth resolution : 0.02 nm

Max temperature : 300 ℃

Measurement

Analytical balance
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BM-252 (A&D)

Weight measurement range : 0.01 mg ~ 250 g

AE measurement machine
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Continuous Wave Memory

Sample Prepare & Heat Treatment

Precision cutting machine
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Fine cut (HEIWA TECHNICA)

Low-speed precision cutting machine
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Minitom (Struers)

Resin embedding machine
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SimpliMet 4000 (BUEHLER)

pressure range : 1000 ~ 4400 psi

temperature range: 50 ~ 220 ℃

Resin embedding machine
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CitoVac (Struers)

Surface polisher
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MA-200e (MUSASHINO DENSHI)

Rotation speed : 0 ~ 200 rpm

Surface polisher
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AutoMet 250 Pro (BUEHLER)

Ion milling equipment
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SVM-721 (Sanyu Electron Co., Ltd.)

Acceleration voltage: 2–8 kV (in 1 kV steps)

Beam current: up to 150 µA

Beam diameter: φ4 mm

Maximum milling rate: approximately 50 nm/min (Si substrate at 8 kV)

Working gas: Argon (Ar) gas

Maximum sample size: φ50 mm × t20.5 mm

Image furnace
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RHL-E45P (ULVAC-RIKO)

Max temperature : 1400℃

Others

Calculation server
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HPC5000-XBW216TS-D8 (HPC SYSTEMS)

Draft chamber
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Lab.Draft700 Z7P-FL8 (AS ONE)

Temperature & humidity chamber
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SH-242 (ESPEC)

Temperature range : -40 °C~+150 °C

Humidity range : 30 %~95 % RH